Microelectronic Packaging (New Trends in Electrochemical Technology)

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  1. Microelectronic Packaging
  2. 1st Edition
  3. CRC Press Online - Series: New Trends in Electrochemical Technology

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The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area.

A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists. Read more Read less. Sponsored products related to this item What's this? Page 1 of 1 Start over Page 1 of 1. The Skeptics' Guide to the Universe: Converging and diverging views on the mind, the self, consciousness, the unconscious, free will, perception, meditation, and other topics.

Microelectronic Packaging

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Please try again later. A Book on Electrochemistry in Semiconductors. This book is the third in a series that focuses on the contribution of new applications of electrochemical technology to the advancement of the electronic and communication industries. This volume goes beyond the title topic of "Microelectronic Packaging. Especially relevant to my own field of interest was the chapter of Chemical Mechanical Planarization Chapter 15 , which I found to be exceptionally well-written.

1st Edition

The authors provided a nice balance of reviewing CMP while presenting their own very interesting research and development efforts. This book is long overdue, and given the continued introduction of novel electrochemical technologies to the fabrication of next generation devices, I would hope there is another volume in the works. We provide a free online form to document your learning and a certificate for your records.

Already read this title? Please accept our apologies for any inconvenience this may cause. Microelectronic Packaging 1st Edition M. Datta, Tetsuya Osaka, J.

CRC Press Online - Series: New Trends in Electrochemical Technology

Add to Wish List. Toggle navigation Additional Book Information. Description Table of Contents. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging.

The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials.

Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.