Practical Guide To The Packaging Of Electronics: Thermal And Mechanical Design And Analysis

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Practical Guide To The Packaging Of Electronics Thermal And Mechanical Design And Analysis

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Features Provides equations to readily solve design problems in a simplified manner Enables the engineer or program manager to define system design guidelines Helps engineers and managers understand reliability factors in packaging Defines system guidelines for both thermal and mechanical factors Summary Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Addresses various cross-discipline issues in the design of electromechanical products Provides a solid foundation for heat transfer, vibration, and life expectancy calculations Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Author s Bio Author.

Reviews "This book is intended for a hands-on engineer who needs back-of-the-envelope tools to develop design parameters and develop a means to conduct sanity checks. Request an e-inspection copy.

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Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis

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